Aluminum Nitride (AlN) Substrates
When heat must be dissipated quickly and reliably in order to protect the valuable components. This is where Ortech Aluminum Nitride Substrate set the benchmark. With outstanding insulating properties and extremely high thermal conductivity.
Aluminum Nitride Substrate Advantages
• Very high thermal conductivity (> 180 W/mK)
• Non-toxic alternative to BeO
• Low thermal expansion 4 to 6×10-6K-1 (between 20 and 1000°C) similar to Si, GaN,
and GaAs semiconductors
• High dielectric strength
In-House Advanced Machining Processes
Ortech provides all the advanced services you need to
shorten lead times and improve component quality.
• Laser machining • Polishing
• Lapping • Laser etching • Metalization capacity
Standard & custom substrate available
Standard squares: 25.4, 50.8, 57.1, 63.5, 76.2, 101.6, 114.3, 121.9 mm (1ʺ, 2ʺ, 2.25ʺ, 3″, 4ʺ, 4.5ʺ, 4.8ʺ)
Standard rounds: 100, 150 mm (3.937ʺ, 5.905ʺ)
Thicknesses available: 0.2 – 3.556 mm (0.008ʺ to 0.140ʺ)
Consult with Ortech Engineers
Ortech has a highly qualified staff to assist with material
selection and product design. Please contact us today at
+1 916-549-9696 or firstname.lastname@example.org for more information.