Key Features of Silicon Nitride (Si₃N₄) Substrates
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High-strength Silicon Nitride substrate offering exceptional durability and bending strength — approximately twice as strong as Alumina and Aluminum Nitride (AlN) substrates
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High thermal conductivity ceramic substrate with up to 3× higher heat transfer capability compared to Alumina and ZTA, ideal for high-power electronic devices
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Excellent electrical insulation performance featuring high dielectric breakdown voltage and very high surface and volume resistivity
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Low coefficient of thermal expansion (CTE) close to silicon, reducing thermal mismatch stress in semiconductor, power module, and LED applications
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Stable performance in extreme environments — resists thermal shock, high temperatures, mechanical stress, and corrosive conditions
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Ideal for high-power and high-reliability applications, including IGBT modules, automotive power electronics, aerospace electronics, RF power amplifiers, and industrial energy systems
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Available in multiple sizes and thicknesses, with custom dimensions and high-volume production supported upon request
Consult with Ortech Engineers
Ortech has a highly qualified staff to assist with material selection. They also help with product design. Please contact us today at
+1 916-549-9696 or in**@************cs.com for more information.
