Project Description
Sample Products
Manufacturing Options
- Isostatic pressing
- Die Pressing
- Injection molding
Advanced Finishing Services
- Precision grinding and lapping
- Laser machining
- Engineering design and support
- Threaded components
- Precision motion components
- Complex cleanroom assemblies
Material Properties Silicon Nitride
| Density | gm/cc | 3.20 |
|---|---|---|
| Crystal Size (Average) | Microns | – |
| Water absorption (open porosity) | % | 0 |
| Gas permeability | % | 0 |
| Color | ¯ | Gray |
| Flexural Strength (MOR) 20°C | MPa (psi x 103) | 900 |
|---|---|---|
| Elastic Modulus 20°C | GPa (psi x 106) | 315 |
| Poisson’s Ratio 20°C | ¯ | – |
| Compressive Strength 20°C | MPa (psi x 103) | 2500 |
| Hardness | GPa (kg/mm2) | 16 |
| R45N | – | |
| Tensile Strength 25°C | MPa (psi x 103) | – |
| Fracture Toughness K(I c) | mpa m1/2 | 7.5 |
| Thermal Conductivity 20°C | W/m K | 19 |
|---|---|---|
| Coefficient of Thermal Expansion 25-1000°C | X 10-6/°C | 3.1 |
| Specific Heat 100°C | 880 J/kg*K | 800 |
| Thermal Shock Resistance ΔTc | °C | – |
| Maximum Use Temperature | °C | 1400 |
| Dielectric Strength 6.35mm | ac-kV/mm (ac V/mil) | 15 |
|---|---|---|
| Dielectric Constant 1 MHz | 25°C | – |
| Dielectric Loss (tan delta) 1 MHz | 25°C | – |
| Volume Resistivity 25°C | ohm-cm | |
| 500°C | ohm-cm | |
| 1000°C | ohm-cm |
*The chart is intended to illustrate typical properties. Property values vary with method of manufacture, size, and shape of part. Data contained herein is not to be construed as absolute and does not constitute a representation or warranty for which Ortech, Inc. assumes legal responsibility.
Products made from Silicon Nitride (Si3N4)
- Bearing Rollers
Ball Bearing
- Nozzles
- Seal Rings, Bearings and Sealing
- Tubes and Pipes
