Project Description

Sample Products

Manufacturing Options

Advanced Finishing Services

  • Precision grinding and lapping
  • Laser machining
  • Engineering design and support
  • Complex cleanroom assemblies

Material Properties Silicon Nitride

Crystal Size (Average)Microns
Water absorption (open porosity)%0
Gas permeability%0
Flexural Strength (MOR) 20°CMPa (psi x 103)900
Elastic Modulus 20°CGPa (psi x 106) 315
Poisson’s Ratio 20°C¯ –
Compressive Strength 20°CMPa (psi x 103) 2500
HardnessGPa (kg/mm2) 16
R45N –
Tensile Strength 25°CMPa (psi x 103) –
Fracture Toughness K(I c)mpa m1/2 7.5
Thermal Conductivity 20°CW/m K19
Coefficient of Thermal Expansion 25-1000°CX 10-6/°C3.1
Specific Heat 100°C880 J/kg*K800
Thermal Shock Resistance   ΔTc °C
 Maximum Use Temperature  °C 1400
Dielectric Strength 6.35mmac-kV/mm (ac V/mil)15
Dielectric Constant 1 MHz25°C –
Dielectric Loss (tan delta) 1 MHz25°C –
Volume Resistivity 25°Cohm-cm
*The chart is intended to illustrate typical properties. Property values vary with method of manufacture, size, and shape of part. Data contained herein is not to be construed as absolute and does not constitute a representation or warranty for which Ortech, Inc. assumes legal responsibility.

Products made from Silicon Nitride (Si3N4)

  • Nozzles
  • Seal Rings, Bearings and Sealing
  • Tubes and Pipes

Standard catalog that you can purchase online