Project Description
Key Benefits
- Easily machinable
- Withstands high temperatures
- Low thermal conductivity
- Electrical insulator
- Zero porosity and no out gassing
- Strong & rigid
- Highly polishable
- can be soldered to a wide range of material
- Radiation resistant
- Lead free
Advanced Finishing Services
- Precision grinding and lapping
- Laser machining
- Engineering design and support
- Metallizing
- Threaded components

Material Properties (Macor Glass Ceramic)
Density | 2.52 g/cm3 |
Porosity | 0% |
Young’s Modulus, 25°C | 66.9 GPa |
Poisson’s Ratio | 0.29 |
Shear Modulus, 25°C | 25.5 GPa |
Hardness, Knoop, 100g | 250 |
Rockwell A | 48 |
Modulus of Rupture, 25°C | 94 MPa |
Compressive strength | 345 MPa |
Fracture Toughness | 1.53 MPa m0.5 |
Thermal | |
---|---|
Coefficient of Expansion | |
-200 to 25°C | 74×10-7/°C |
25 to 300°C | 93×10-7/°C |
25 to 600°C | 114×10-7/°C |
25 to 800°C | 126×10-7/°C |
Specific Heat, 25°C | .79KJ/kg°C |
Thermal Conductivity, 25°C | 1.46 W/m°C |
Thermal Diffusivity, 25°C | 7.3×10-7m2/s |
Continuous Operating Temperature | 800°C |
Maximum No Load Temperature | 1000°C |
Electrical | |
---|---|
Dielectric Constant, 25°C | |
1 KHz | 6.03 |
8.5 GHz | 5.67 |
Loss Tangent, 25°C | |
1KHz | 4.7×10-3 |
8.5 GHz | 7.1×10-3 |
Dielectric Strength (AC) avg
(at 0.3mm thickness and 25°C) |
9.4 KV/mm |
Dielectric Strength (DC) avg.
(at 0.3mm thickness and 25°C) |
62.4 KV/mm |
DC Volume Resistivity, 25°C | >1016 ohm-cm |
*The chart is intended to illustrate typical properties. Property values vary with method of manufacture, size, and shape of part. Data contained herein is not to be construed as absolute and does not constitute a representation or warranty for which Ortech, Inc. assumes legal responsibility.